Investigation of Pre-Bending Substrate Design on Packaging Assembly of IGBT Power Module

Conference paper

C. C. Lee, K. S. Kao, Leon Lin, J. Y. Chang, F. J. Leu, Y. L. Lu and T. C. Chang

Materials for Advanced Metallization Conference (MAM 2013) Materials for Advanced Metallization Conference (MAM 2013)

2013

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Title: Investigation of Pre-Bending Substrate Design on Packaging Assembly of IGBT Power Module
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
K. S. Kao
Leon Lin
J. Y. Chang
F. J. Leu
Y. L. Lu
T. C. Chang
Publication Details: Materials for Advanced Metallization Conference (MAM 2013) Materials for Advanced Metallization Conference (MAM 2013)
Identifiers: 9957771984706774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper