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Investigation of Surface Properties of Patterning Electrode in a Highly Flexible Package
Conference paper

Investigation of Surface Properties of Patterning Electrode in a Highly Flexible Package

B. J. Wen, C. C. Lee, M. W. Chang, H. K. Lin and Y. H. Guo
Proceedings of the 38th Conference on Theoretical and Applied Mechanics Proceedings of the 38th Conference on Theoretical and Applied Mechanics
2014

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