Joule heating effect under accelerated electromigration in flip-chip solder joints

S.H. Chiu; S.W. Liang; Chih Chen; D.J. Yao; Y.C. Liu; K.H. Chen; S.H. Lin

doi:10.1109/ECTC.2006.1645721

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Conference paper

Joule heating effect under accelerated electromigration in flip-chip solder joints

S.H. Chiu, S.W. Liang, Chih Chen, D.J. Yao, Y.C. Liu, K.H. Chen and S.H. Lin

Proceedings - Electronic Components and Technology Conference, Vol.2006, pp.663-666

2006

DOI: https://doi.org/10.1109/ECTC.2006.1645721

Abstract

This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration. © 2006 IEEE.

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Title: Joule heating effect under accelerated electromigration in flip-chip solder joints
Creators - without role: S.H. Chiu - National Yang Ming Chiao Tung University
S.W. Liang - National Yang Ming Chiao Tung University
Chih Chen - National Yang Ming Chiao Tung University
D.J. Yao - National Tsing Hua University
Y.C. Liu - MEGIC Technology
K.H. Chen - MEGIC Technology
S.H. Lin - MEGIC Technology
Publication Details: Proceedings - Electronic Components and Technology Conference, Vol.2006, pp.663-666
Identifiers: 1424401526; 9781424401529; 9957773094906774
Academic Unit: Department of Physical Education, Hsinchu Teachers College, National Tsing Hua University
Language: English
Resource Type: Conference paper

Joule heating effect under accelerated electromigration in flip-chip solder joints

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