Abstract
We successfully bonded the glass substrates which had nm scale roughness. Roughness on the bonding surfaces were intentionally produced by dry etching, and controlled with 0.1-10 nm scale in Ra. In smaller than 5.2 nm, the substrates were bonded, but the bonding strength was decreased with increasing the roughness. In 9.0 nm, the substrates were not bonded. These technology and finding will help the design and fabrication of glass micro/nanofluidic devices, especially for complicated devices involving multiple materials.