Lead-free composite solder with an indium layer

Conference paper

Sinn-wen Chen, Shih-kang Lin and C.-F. Yang

2004年中國材料學會年會(2004 Materials Research Society-Taiwan Annual Meeting,簡寫MRS-T 2004)(Invited speech) 2004年中國材料學會年會

2004

Abstract

Lead-free composite solder;indium layer

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Title: Lead-free composite solder with an indium layer
Creators - without role: Sinn-wen Chen - 國立清華大學工學院化學工程學系
Shih-kang Lin
C.-F. Yang
Publication Details: 2004年中國材料學會年會(2004 Materials Research Society-Taiwan Annual Meeting,簡寫MRS-T 2004)(Invited speech) 2004年中國材料學會年會
Identifiers: 9957772117106774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper