Abstract
Progressive sintering combining near infrared (NIR) and inteive pulse light (IPL) was proposed with optimized process parameters to satisfy low-temperature and efficiency requirement for inkjet-printed copper (Cu) nanoparticle in this work. Unlike other IPL proposals, this progressive sintering reduced the resistivity of Cu mainly during NIR itead of IPL, leaving the sintered metal film intact without cracks and delaminations from the substrate. A 24% bulk conductivity was achieved with this proposal.