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MEMS above CMOS process for single proof-mass 3-AXIS Lorentz-force resonant magnetic sensor
Conference paper

MEMS above CMOS process for single proof-mass 3-AXIS Lorentz-force resonant magnetic sensor

W.L. Sung, F.Y. Lee, C.L. Cheng, C.I. Chang, E. Cheng and W. Fang
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vol.2016-February, pp.978-981
26/02/2016

Abstract

This study designs and implements a silicon-based 3-axis Lorentz-force resonant magnetic sensor with single proof-mass using TSMC bulk MEMS above standard CMOS process [1]. The device is a 3-axis resonant-type sensor driven by single current loop. When the magnetic fields applied, the Lorentz-force is induced by current-carrying spring-mass structure and driven the structure at resonant frequency. Capacitance sensing electrodes could detect the dynamic responses of spring-mass system to determine the intensity of magnetic fields. Features of this study: (1) novel spring design acts as current-carrying and enables torsional/in-plane translational motions by magnetic fields; (2) single proof-mass and current loop for 3-axis magnetic fields detection; (3) fully compatible with MEMS inertial sensors process platform. A 1mm - 1mm single proof-mass structure with gap-closing sensing electrodes for 3-axis magnetic fields detection is demonstrated.

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