Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications

Ching-Hua Wang; Kun-Yu Dai; Kuei-Hung Shen; Yung-Hung Wang; Ming-Jinn Tsai; Chrong Jung Lin; Ya-Chin King

doi:10.1109/IEDM.2013.6724689

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Conference paper

Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications

Ching-Hua Wang, Kun-Yu Dai, Kuei-Hung Shen, Yung-Hung Wang, Ming-Jinn Tsai, Chrong Jung Lin and Ya-Chin King

Technical Digest - International Electron Devices Meeting, IEDM, 6724689

2013

DOI: https://doi.org/10.1109/IEDM.2013.6724689

Appears in keyword about Physics

Abstract

Electrical and Electronic Engineering

Condensed Matter Physics

Electronic

Optical and Magnetic Materials

Materials Chemistry

A new wireless 3D IC connection method, Magnetic-sensing Transmission Interface (MTI), is reported, for the first time. MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a micro-coil is successfully demonstrated. This new contactless connection scheme offers low-power, wide-bandwidth and multi-layer wireless data transmission for 3D ICs. © 2013 IEEE.

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Title: Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications
Translated title: Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications
Creators - without role: Ching-Hua Wang - Microelectronics Laboratory , Institute of Electronics Engineering , National Tsing-Hua University (NTHU)
Kun-Yu Dai - National Tsing Hua University
Kuei-Hung Shen - Electronics and Optoelectronics Research Laboratory , Industrial Technology Research Institute
Yung-Hung Wang - Industrial Technology Research Institute
Ming-Jinn Tsai - Electronics and Optoelectronics Research Laboratory , Industrial Technology Research Institute
Chrong Jung Lin - National Tsing Hua University
Ya-Chin King - Microelectronics Laboratory , Institute of Electronics Engineering , National Tsing-Hua University (NTHU)
Publication Details: Technical Digest - International Electron Devices Meeting, IEDM, 6724689
Identifiers: 9781479923076; 9957769632606774
Academic Unit: Institute of Electronics Engineering, College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: English
Resource Type: Conference paper

Magnetic wireless interlayer transmission through perpendicular MTJ for 3D-IC applications

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