Abstract
Split fabrication is a promising approach to security against attacks by untrusted foundries. While existing split fabrication methods consider the overhead of conventional objectives such as wirelength and timing, they mostly neglect manufacturability - an unavoidable challenge in nanometer technologies. Observing that security and manufacturability can be addressed in a synergistic manner, this work introduces routing techniques that can simultaneously improve both security and manufacturability in terms of either Chemical Mechanical Planarization (CMP) uniformity or Self-Aligned Double Patterning (SADP) compliance. The effectiveness of these techniques is confirmed by experiments on benchmark circuits.