Managing Induced Warpage of 3D-ICs Packaging Using Multi-Layered Molding Materials

Conference paper

C. C. Lee, Y. H. Guo, H. C. Liu, Y. M. Lin and T. C. Chang

7th IEEE International Nanoelectronics Conference (IEEE INEC2016) 7th IEEE International Nanoelectronics Conference (IEEE INEC2016)

2016

Metrics

1 Record Views

Title: Managing Induced Warpage of 3D-ICs Packaging Using Multi-Layered Molding Materials
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
Y. H. Guo
H. C. Liu
Y. M. Lin
T. C. Chang
Publication Details: 7th IEEE International Nanoelectronics Conference (IEEE INEC2016) 7th IEEE International Nanoelectronics Conference (IEEE INEC2016)
Identifiers: 9957775750306774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper