- Title
- Material Characteristic Effect of Wafer Level Underfill on the Microbump Reliability of Ultra-Thin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests
- Creators - without role
- 昌駿 李 - 國立清華大學工學院動力機械工程學系
- Publication Details
- International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017) International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
- Identifiers
- 9957772282406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Material Characteristic Effect of Wafer Level Underfill on the Microbump Reliability of Ultra-Thin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests
International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017) International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
2017
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