- Title
- Material Issues in Microelectronic Package Reliability
- Creators - without role
- Jenq-Gong Duh - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957766351306774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012 Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012
Conference paper
Material Issues in Microelectronic Package Reliability
Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012 Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012
2012
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