- Title
- Materials Issue in Unleaded Solder Joints
- Creators - without role
- J.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- First International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing First International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing
- Identifiers
- 9957767993806774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Materials Issue in Unleaded Solder Joints
First International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing First International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing
1998
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