- Title
- Mechanical Behavior Investigation of Creep and Warpage for Thin-Type Three-Dimensional Integrated Circuits Packaging Structures
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系Y. H. GuoH. C. Liu
- Publication Details
- Proceedings of the 32th National Conference on Mechanical Engineering (CSME) Proceedings of the 32th National Conference on Mechanical Engineering (CSME)
- Identifiers
- 9957777553906774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Mechanical Behavior Investigation of Creep and Warpage for Thin-Type Three-Dimensional Integrated Circuits Packaging Structures
Proceedings of the 32th National Conference on Mechanical Engineering (CSME) Proceedings of the 32th National Conference on Mechanical Engineering (CSME)
2015
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