- Title
- Metallurgical Reaction between Electroless Ni Metallized Al2O3 Substrate and Unlead 42Sn-58Bi Solders during Annealing
- Creators - without role
- J. G. Duh - 國立清華大學工學院材料科學工程學系B. L.Young
- Publication Details
- 2001 International Conference on Electronics Packaging 2001 International Conference on Electronics Packaging
- Identifiers
- 9957772478406774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Metallurgical Reaction between Electroless Ni Metallized Al2O3 Substrate and Unlead 42Sn-58Bi Solders during Annealing
2001 International Conference on Electronics Packaging 2001 International Conference on Electronics Packaging
2001
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