- Title
- Metallurgical Reaction between Ni/Cu UBM and Lead-Free Sn-Ag Flip Chip Solder Bump
- Creators - without role
- C.S. HuangY.M. ChenJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 2003 TMS Annual Meeting & Exhibition 2003 TMS Annual Meeting & Exhibition
- Identifiers
- 9957774093206774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Metallurgical Reaction between Ni/Cu UBM and Lead-Free Sn-Ag Flip Chip Solder Bump
2003 TMS Annual Meeting & Exhibition 2003 TMS Annual Meeting & Exhibition
2003
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