Microbump Reliability Prediction of Stacked Thin Chips in 3D-ICs Assembly under a Temperature Cycling Test

Conference paper

C. C. Lee, K. S. Kao and T. C. Chang

3rd International Symposium on Next-Generation Electronics (ISNE 2014) 3rd International Symposium on Next-Generation Electronics (ISNE 2014)

2014

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Title: Microbump Reliability Prediction of Stacked Thin Chips in 3D-ICs Assembly under a Temperature Cycling Test
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
K. S. Kao
T. C. Chang
Identifiers: 9957773172906774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 3rd International Symposium on Next-Generation Electronics (ISNE 2014) 3rd International Symposium on Next-Generation Electronics (ISNE 2014)