- Title
- Microstructure Evaluation of the Unleaded Cu-Sn-Ni Solder Joint in Microelectronic Package
- Creators - without role
- J. G. Duh - 國立清華大學工學院材料科學工程學系C. C. YoungY. G. Lee
- Publication Details
- Second International Symposium on Electronic Packaging Technology Second International Symposium on Electronic Packaging Technology
- Identifiers
- 9957777165606774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Microstructure Evaluation of the Unleaded Cu-Sn-Ni Solder Joint in Microelectronic Package
Second International Symposium on Electronic Packaging Technology Second International Symposium on Electronic Packaging Technology
1996
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