- Title
- Mis-orientation between the Grains of Cu-Sn IMC from Cu and Cu-Zn Sides in Cu/Sn-3.5Ag/Cu-xZn Microbumps
- Creators - without role
- W. Y. ChenC. FleshmanW. TuJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957773669006774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015
Conference paper
Mis-orientation between the Grains of Cu-Sn IMC from Cu and Cu-Zn Sides in Cu/Sn-3.5Ag/Cu-xZn Microbumps
Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015
2015
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