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Module placement with boundary constraints using the sequence-pair representation
Conference paper

Module placement with boundary constraints using the sequence-pair representation

Jianbang Lai, Ming-Shiun Lin, Ting-Chi Wang and L.-C. Wang
Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, Vol.2001-January, pp.515-520
2001
DOI: https://doi.org/10.1109/ASPDAC.2001.913360

Abstract

Algorithm design and analysis Computational modeling Cost function Design methodology Routing Simulated annealing Stochastic processes Topology Very large scale integration Wire
In VLSI module placement, it is very practical to consider placing some modules along the pre-specified boundaries of the chip so that the modules are easier to be connected to certain I/O pads. In this paper, we study the module placement problem where some modules have boundary constraints, and present a simulated annealing based algorithm that represents each placement topology by a sequence-pair. The major contribution of our algorithm is that a feasible placement is always obtainable. Our algorithm has been implemented, and its effectiveness is supported by the encouraging experimental results.

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