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Multifunction Force Sensor with Hollow Structure
Conference paper

Multifunction Force Sensor with Hollow Structure

Yu-Hao Jen, Chia-Tso Mo, Yu-Wen Chen and Cheng-Yao Lo
FLEPS 2020 - IEEE International Conference on Flexible and Printable Sensors and Systems, 9239471
08/2020

Abstract

capacitance sensitivity tactile sensor Hardware and Architecture Electrical and Electronic Engineering Materials Science (miscellaneous) Instrumentation
In this study, the material of the dielectric layer was changed to reduce the structural rigidity of a capacitive tactile sensor, achieving the result of increasing the detection sensitivity without affecting the spatial resolution. Simulation and experimental results showed that the sensitivity of the sensor can be greatly improved by changing the elastomeric dielectric layer from a solid structure to a hollow structure. When the normal force was 0.25 N, the average detection sensitivity of the hollow structure was 32 pF/N. Compared with the solid counterpart, the sensitivity was increased by roughly 600 times. When the shear force was 1.5 N, the average detection sensitivity of the hollow structure was 0.1 pF/N. Compared with the solid counterpart, it showed an improvement of at least five times regardless of the shear angle. In addition, the measured shear angle exhibited a tolerance of no more than 4°, which was similar to the announced sensors.

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