- Title
- Nanomechanical Response and Creep Behavior of Electrochemically Deposited Copper Film under Nanoindentation Test
- Creators - without role
- Shou-Yi Chang - 國立清華大學工學院材料科學工程學系Ting-Kui ChangYu-Shuien Lee
- Identifiers
- 9957777471206774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Proceedings of Symposium “E: Mechanical Behavior of Nano- and Micro-Scale Systems” of the 3rd International Conference on Materials for Advanced Technology Proceedings of Symposium “E: Mechanical Behavior of Nano- and Micro-Scale Systems” of the 3rd International Conference on Materials for Advanced Technology (ICMAT & IUMRS-ICAM 2005)
Conference paper
Nanomechanical Response and Creep Behavior of Electrochemically Deposited Copper Film under Nanoindentation Test
Proceedings of Symposium “E: Mechanical Behavior of Nano- and Micro-Scale Systems” of the 3rd International Conference on Materials for Advanced Technology Proceedings of Symposium “E: Mechanical Behavior of Nano- and Micro-Scale Systems” of the 3rd International Conference on Materials for Advanced Technology (ICMAT & IUMRS-ICAM 2005)
2005
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