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Nanotwinned Cu thin film with different twin boundary orientations deposited by unbalanced magnetron sputtering
Conference paper

Nanotwinned Cu thin film with different twin boundary orientations deposited by unbalanced magnetron sputtering

Hsin-Yuan Chen, Kai Hung Yang and Fan-Yi Ouyang
ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, pp.596-600
20/05/2015

Abstract

Corrosion resistance Cu Hardness Nano twin Orientation resistivity sputter
Nanotwinned Cu thin films were fabricated on Si (100) substrate by using unbalanced magnetron sputtering (UBMS) system. By varying the deposition rate and the deposition temperature, we observed that there are two major twin orientations. One is parallel to the substrate and the other one makes an angel of 70 degree with the substrate. The effect of twin orientation on the mechanical properties and corrosive behavior was investigated in this study. The results show that the samples with 70.5 degree orientation to the substrate were harder than those with orientation parallel to the substrate The samples with more parallel type of the twin boundary would exhibit better corrosion resistance.

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