- 題名
- Non-destructive evaluation of curing processes in seismic and soundproof building materials using ultrasonic testing
- 創作者：
- Wei-Yang Chung (作者)Yuan Yao - 國立清華大學, 化學工程學系
- 會議
- 20th World Conference on Non-Destructive Testing (20th WCNDT) (Incheon, Korea, 27/05/2024–31/05/2024)
- 學術資源類型
- 會議論文
會議論文
Non-destructive evaluation of curing processes in seismic and soundproof building materials using ultrasonic testing
20th World Conference on Non-Destructive Testing (20th WCNDT) (Incheon, Korea, 27/05/2024–31/05/2024)
指標
1 檢視次數