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Non-operational shock analysis and design of head gimbal assembly in spinning data storage devices
Conference paper   Peer reviewed

Non-operational shock analysis and design of head gimbal assembly in spinning data storage devices

Jen-Yuan Chang and Rana Noman Mubarak
Microsystem Technologies, Vol.18(9-10), pp.1463-1468
09/2012

Abstract

Electronic Optical and Magnetic Materials Condensed Matter Physics Hardware and Architecture Electrical and Electronic Engineering
The work presented in this paper was motivated by the experimental observation of de-bonding phenomena between head gimbal assembly (HGA) and suspension for a commercial 3.5-in. enterprise HDD under non-operational 250 G shock test, which leads to revisit design of HGA/suspension with objective placed on withstanding shocks between the head slider and the suspension. In this study experimental observation and numerical finite element studies were conducted to understand such effect on the mechanical failure of HGA when it is subjected to nonoperational shock in parked position on ramp. It was observed that by changing flexure angle in HGA, shock stress can be reduced. FEA simulation results have been presented to verify the findings. © Springer-Verlag 2012.

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