- Title
- Novel Characterizing Technique in Phase Distribution with Sample Preparation for Application in Solder Joint, Wire Bonding Chip and Li-Ion Battery Assembly
- Creators - without role
- H.K. ChenS.H. LiJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 2005 TMS Annual Meeting & Exhibition 2005 TMS Annual Meeting & Exhibition
- Identifiers
- 9957772991006774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Novel Characterizing Technique in Phase Distribution with Sample Preparation for Application in Solder Joint, Wire Bonding Chip and Li-Ion Battery Assembly
2005 TMS Annual Meeting & Exhibition 2005 TMS Annual Meeting & Exhibition
2005
Metrics
1 Record Views