- Title
- Novel Shrink Lithography by External Stress Orthogonal to the Critical Dimension
- Creators - without role
- Chung-Yuan YangJian-Wei HongChin-Yen LinCheng-Yao Lo - 國立清華大學工學院動力機械工程學系
- Identifiers
- 9957772845506774
- Academic Unit
- Institute of NanoEngineering and Microsystems, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Conference paper
Novel Shrink Lithography by External Stress Orthogonal to the Critical Dimension
The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
2014
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