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Observation on electromigration induced nanoscale lamellar microstructure change in eutectic SnPb flip chip solder joints
Conference paper

Observation on electromigration induced nanoscale lamellar microstructure change in eutectic SnPb flip chip solder joints

Hao Hsu and Fan-Yi Ouyang
AMD fusion 7th Annual Technical Forum & Exhibition AMD fusion 7th Annual Technical Forum & Exhibition
2011

Abstract

eutectic SnPb flip chip solder joints

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