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Offset-Via Anti-fuse by Cu BEOL Process in Advanced CMOS Technologies
Conference paper

Offset-Via Anti-fuse by Cu BEOL Process in Advanced CMOS Technologies

Li-Yu Yeh, Chrong-Jung Lin and Ya-Chin King
2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings
2023
DOI: https://doi.org/10.1109/VLSI-TSA/VLSI-DAT57221.2023.10133946

Abstract

Artificial Intelligence Computer Networks and Communications Computer Science Applications Hardware and Architecture Information Systems Electrical and Electronic Engineering
An offset-Via one-time programmable memory anti-fuse cell is proposed and implemented by FinFET CMOS logic process. By forming in thin dielectric layer in an offset-via structure, the cell can switch states under low programming current. Multi-level resistance states can be achieved by compliance current control. Excellent reliability and data stability of this new cell are also demonstrated.

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