Optimal Ni(P) Thickness Selection in SnAgCu Lead Free Solder/Ultrathin-ENEPIG Law Impedance Surface Finish

Conference paper

C.Y. Ho and J.G. Duh

The 15th International Conference on Electronic Materials and Packaging The 15th International Conference on Electronic Materials and Packaging

2013

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Title: Optimal Ni(P) Thickness Selection in SnAgCu Lead Free Solder/Ultrathin-ENEPIG Law Impedance Surface Finish
Creators - without role: C.Y. Ho
J.G. Duh - 國立清華大學工學院材料科學工程學系
Identifiers: 9957773421206774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: The 15th International Conference on Electronic Materials and Packaging The 15th International Conference on Electronic Materials and Packaging