- Title
- Orientation Imaging Studies of Sn3.0Ag0.5Cu Solder Joint with Various Ni Doping after Aging
- Creators - without role
- K.J. WangJ.M. WangC.F. TsengJ.G. Duh - 國立清華大學工學院材料科學工程學系T.K. LeeK.C. Liu
- Publication Details
- TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition
- Identifiers
- 9957766105206774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Orientation Imaging Studies of Sn3.0Ag0.5Cu Solder Joint with Various Ni Doping after Aging
TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition
2010
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