- Title
- Overview for Current Material Issue in Solder Joint Reliability
- Creators - without role
- Chien-Fu TsengChi-Yang YuHsiu-Min LinCheng-Ying HoYi-Shin WuJenq-Gong Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 5th Straits Forum on Advanced Packaging Material and Development Trends 5th Straits Forum on Advanced Packaging Material and Development Trends
- Identifiers
- 9957776438006774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Overview for Current Material Issue in Solder Joint Reliability
5th Straits Forum on Advanced Packaging Material and Development Trends 5th Straits Forum on Advanced Packaging Material and Development Trends
2013
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