- Title
- Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
- Creators - without role
- 昌駿 李
- Publication Details
- The 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2020)
- Identifiers
- 9957773067906774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
Conference paper
Packaging Reliability Estimation of High-Power Device Modules by Utilizing Silver Sintering Technology
The 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2020)
10/2020
Appears in keyword about Physics
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