Phase Characterization and Elemental Redistribution in Solder Joints for Microelectronics Packaging by Utilizing FE-SEM and FE-EPMA

Conference paper

C.F. Tseng, J.G. Duh and S.Y. Tsai

Chinese Electron Microscopy Society Chinese Electron Microscopy Society

2011

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Title: Phase Characterization and Elemental Redistribution in Solder Joints for Microelectronics Packaging by Utilizing FE-SEM and FE-EPMA
Creators - without role: C.F. Tseng
J.G. Duh - 國立清華大學工學院材料科學工程學系
S.Y. Tsai
Identifiers: 9957776106506774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Chinese Electron Microscopy Society Chinese Electron Microscopy Society