- Title
- Phase Evolution and Diffusion Path in the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump during Aging
- Creators - without role
- G.Y. JangJ.G. Duh - 國立清華大學工學院材料科學工程學系S.W. LuJ.C. Chen
- Identifiers
- 9957772381106774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Materials Science & Technology 2005 conference and Exhibition Materials Science & Technology 2005 conference and Exhibition
Conference paper
Phase Evolution and Diffusion Path in the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump during Aging
Materials Science & Technology 2005 conference and Exhibition Materials Science & Technology 2005 conference and Exhibition
2005
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