- Title
- Phase Transformation and Long-term Stabilization of New ENEPIG Surface Finish with Ultra-thin Ni(P) Deposit Solder Joints in Low Impedance Microelectronic Packaging
- Creators - without role
- C. Y. Ho - 國立清華大學工學院材料科學工程學系J. G. Duh
- Identifiers
- 9957772818206774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition
Conference paper
Phase Transformation and Long-term Stabilization of New ENEPIG Surface Finish with Ultra-thin Ni(P) Deposit Solder Joints in Low Impedance Microelectronic Packaging
The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition
2013
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