- Title
- Phenomenon Investigation of Stress-Induced Voiding for Nano-Scaled Copper Thin Films
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系W. C. WangT. L. Tzeng
- Identifiers
- 9957771239006774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014) 7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014)
Conference paper
Phenomenon Investigation of Stress-Induced Voiding for Nano-Scaled Copper Thin Films
7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014) 7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014)
2014
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