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Photoelastic investigation on thermal stresses in bonded structures
Conference paper

Photoelastic investigation on thermal stresses in bonded structures

Jiong-Shiun Hsu and Wei-Chung Wang
Proceedings of SPIE - The International Society for Optical Engineering, Vol.4537, pp.170-173
2001

Abstract

Bi-material structure Casting Digital photoelasticity Finite element method Interfacial stresses
The digital photoelastic and finite element methods were combined to clarify the interfacial stresses predicted by Suhir's theories. A special casting procedure was employed to obtain a true bi-material structure such that the theoretical assumptions can be satisfied. Through the analysis, some behaviours of the interfacial stresses were clarified. Besides, the distributions of the thermal stresses in the adherends calculated by Suhir and Timoshenko's theories were also discussed.

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