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Prediction of Fan-Out Level Packaging Warpage using PSO-based Modified Convolutional Neural Network model with Laplacian Filter
Conference paper

Prediction of Fan-Out Level Packaging Warpage using PSO-based Modified Convolutional Neural Network model with Laplacian Filter

G.R. Huang, M.Y. Chen and K.N. Chiang
2021 International Conference on Electronics Packaging, ICEP 2021, pp.101-102
05/2021
DOI: https://doi.org/10.23919/ICEP51988.2021.9451964

Abstract

Convolutional Neural Network Equivalent CTE Fan-Out Panel Level Packaging Machine Learning Particle Swarm Optimization Electrical and Electronic Engineering Mechanics of Materials Electronic Optical and Magnetic Materials Instrumentation
The Fan-out Panel Level Packaging model after the molding process is established. We simplify the complex curing reaction of epoxy molding compound with equivalent thermal expansion coefficient method. We successfully use finite element method to build different geometric Fan-out Panel Level Packaging model as training dataset for machine learning. In the end, we used the modified Convolution Neural Network to estimate the amount of fan-out panel-level package warpage under different geometries. To avoid local minimum, Particle Swarm Optimization, PSO, is introduced for neural network parameter.

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