- Title
- Predictions and Measurements of Interfacial Adhesion among Encapsulated Thin Films of Flexible Devices
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系P. J. WeiB. T. ChianC. H. Tsai
- Identifiers
- 9957766620506774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014) 7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014)
Conference paper
Predictions and Measurements of Interfacial Adhesion among Encapsulated Thin Films of Flexible Devices
7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014) 7th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2014)
2014
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