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Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices
Conference paper   Peer reviewed

Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices

Chang-Chun Lee, Pal-Jen Wei, Bow-Tsin Chian, Chia-Hao Tsai and Yu-Hua Dzeng
Thin Solid Films, Vol.584, pp.154-160
06/2015

Abstract

Encapsulation Finite element analysis Flexibility Four-point bending test Organic light emitting diodes Electronic Optical and Magnetic Materials Surfaces and Interfaces Surfaces Coatings and Films Metals and Alloys Materials Chemistry
This study employed the four-point bending test (4-PBT) to measure the interfacial strength of pressure-sensitive adhesive (PSA)/SiN passivation stacked thin films. Finite element analysis (FEA) is combined with the J integral approach and the modified virtual crack closure technique to validate the results of 4-PBT. The FEA simulation results verify the measurement results. The stress status and energy release rate of the delaminated tip are also determined at different elevations of stacked thin films of 4-PBT specimens adjacent to the PSA/SiN interface. The crack in the PSA parallel to the foregoing interface with a slight span occurs on the fractured interface. This behavior is confirmed by observing the scanning electron micrographs of the specimens after 4-PBT.

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