Probing Interfacial Reactions in Sn-3.0Ag-0.5Cu Solder Joint Attached to ENIG and ENEPIG Surface Finishes

Conference paper

C.F. Tseng, T.K. Lee, G. Ramakrishna, K.C. Liu and J.G. Duh

TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition

2011

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Title: Probing Interfacial Reactions in Sn-3.0Ag-0.5Cu Solder Joint Attached to ENIG and ENEPIG Surface Finishes
Creators - without role: C.F. Tseng
T.K. Lee
G. Ramakrishna
K.C. Liu
J.G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition
Identifiers: 9957771616406774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper