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Quality factor boosting via mechanically-coupled arraying
Conference paper

Quality factor boosting via mechanically-coupled arraying

Yu-Wei Lin, Li-Wen Hung, Sheng-Shian Li, Zeying Ren and Clark T.-C. Nguyen
TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, pp.2453-2456
2007

Abstract

Capacitive transducer Fabrication yield Micromechanical circuit Quality factor Resonator
A mechanical circuit-based approach for boosting the Q of a vibrating micromechanical resonator has been demonstrated whereby a low Q resonator is embedded into a mechanically-coupled array of much higher Q resonators to raise its functional Q by a factor approximately equal to the number of resonators in the array. Using this method, the low Q of 7,506 exhibited by a support-loss-limited 60MHz wine-glass disk resonator by itself was effectively raised by about 9X to 63,207 when emplaced into a mechanically-coupled array of eight very high-Q wine-glass disks that then form a composite resonator. The availability of such a circuit-based Q-enhancement technique has far reaching implications, especially considering the possibility of raising the functional Q of a piezoelectric resonator by merely mechanically coupling it to an array of much higher Q capacitively-transduced ones to simultaneously obtain the most attractive characteristics of both technologies: low impedance from the piezo-device and high-Q from the capacitive ones. Furthermore, the methods of this work stand to enhance the manufacturing repeatability of micromechanical resonator-based products, since they present a convenient method for ensuring Q's greater than a specified threshold value, even when some resonator's Q's are lower than it. ©2007 IEEE.

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