Reactions of the (Ag,Cu) Braze with the Ni Substrate in the Microelectronic Joining Processes

Conference paper

S.-W. Chen and H.-T. Luo

The 123th TMS Annual Meeting & Exhibition(1994) 123th TMS Annual Meeting

1994

Abstract

Ag;Cu;Braze;Ni;Microelectronic Joining Processes

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Title: Reactions of the (Ag,Cu) Braze with the Ni Substrate in the Microelectronic Joining Processes
Creators - without role: S.-W. Chen - 國立清華大學工學院化學工程學系
H.-T. Luo
Identifiers: 9957775219506774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: The 123th TMS Annual Meeting & Exhibition(1994) 123th TMS Annual Meeting