Real-time feedback control of ion energy flux in chlorine inductively coupled plasma for poly-silicon etch process

C.H. Chang; K.C. Leou; C. Lin; T.L. Lin; C.W. Tseng; U.W. Liu; C.H. Tsai

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Real-time feedback control of ion energy flux in chlorine inductively coupled plasma for poly-silicon etch process

C.H. Chang, K.C. Leou, C. Lin, T.L. Lin, C.W. Tseng, U.W. Liu and C.H. Tsai

IEEE International Conference on Plasma Science, p.287

2002

Abstract

The real-time multiple-input multiple-output (MIMO) control of both ion density and ion energy in etching of polysilicon using chlorine inductively coupled plasma was experimentally demonstrated. It was shown that the MIMO control system has a better reproducibility in etch rate as compared to current industrial practice.

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Title: Real-time feedback control of ion energy flux in chlorine inductively coupled plasma for poly-silicon etch process
Creators - without role: C.H. Chang - Plasma Processing Laboratory , National Tsing Hua University
K.C. Leou - Plasma Processing Laboratory , National Tsing Hua University
C. Lin - Plasma Processing Laboratory , National Tsing Hua University
T.L. Lin - Plasma Processing Laboratory , National Tsing Hua University
C.W. Tseng - Plasma Processing Laboratory , National Tsing Hua University
U.W. Liu - Plasma Processing Laboratory , National Tsing Hua University
C.H. Tsai - Plasma Processing Laboratory , National Tsing Hua University
Grant note: Plasma Science and Appl. Comm. of IEEE Nuc. and Pl
Identifiers: 9957767215106774
Academic Unit: College of Electrical Engineering and Computer Science, National Tsing Hua University; Department of Engineering and System Science, College of Nuclear Science, National Tsing Hua University; National Tsing Hua University
Language: English
Resource Type: Conference paper
Publication Details: IEEE International Conference on Plasma Science, p.287

Real-time feedback control of ion energy flux in chlorine inductively coupled plasma for poly-silicon etch process

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