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Realizing deep-submicron gap spacing for CMOS-MEMS resonators with frequency tuning capability via modulated boundary conditions
Conference paper

Realizing deep-submicron gap spacing for CMOS-MEMS resonators with frequency tuning capability via modulated boundary conditions

Wen-Chien Chen, Ming-Huang Li, Weileun Fang and Sheng-Shian Li
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp.735-738
2010

Abstract

Electrical and Electronic Engineering,Mechanical Engineering,Electronic Optical and Magnetic Materials,Condensed Matter Physics
Integrated CMOS-MEMS array resonators have been demonstrated that takes advantage of pull-in effect to surmount limitations of CMOS foundry process and attains electrode-to-resonator gap spacing at a deep-submicron range, leading to much smaller motional impedance compared to conventional CMOS-MEMS technologies, while possessing unique frequency tuning capability by modulating their mechanical boundary conditions. With the increase of applied dc-bias which simultaneously serves for functions of pull-in and resonator operation, the upward frequency shift of resonance caused by boundary condition ("BC") change offers opposite tuning mechanism to well-known effect of electrical stiffness. As a result, frequency variation induced by BC-modulation and electrical-stiffness would yield a frequency-insensitive region under a certain dc-bias. ©2010 IEEE.

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