- Title
- Redistributed Geometrical Effect of Cu-Filled Stacked Vias on the Thermal-Induced Stress and Warpage of 3D-ICs Embedded Interposer
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系J. Y. HeP. C. Huang
- Identifiers
- 9957775585406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017) International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
Conference paper
Redistributed Geometrical Effect of Cu-Filled Stacked Vias on the Thermal-Induced Stress and Warpage of 3D-ICs Embedded Interposer
International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017) International Multi-Conference on Engineering and Technology Innovation 2017 (IMETI2017)
2017
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