Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1)wt%Cu/Ni joints

Conference paper

S.-W. Chen, S.-W. Lee, C.-H. Wang and M.-C. Yip

The 132nd TMS Annual Meeting & Exhibition(2003) 132nd (TMS 2003) TMS Annual Meeting

2003

Abstract

mechanical properties;intermetallic compound formation;Sn-0.7(0.5, 0.3, 0.1)wtCu/Ni joints

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Title: Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1)wt%Cu/Ni joints
Creators - without role: S.-W. Chen - 國立清華大學工學院化學工程學系
S.-W. Lee
C.-H. Wang
M.-C. Yip
Publication Details: The 132nd TMS Annual Meeting & Exhibition(2003) 132nd (TMS 2003) TMS Annual Meeting
Identifiers: 9957770137206774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper