Abstract
Reliability is one of the important issues in electronic package components, and some reliability tests, such as thermal cycling test (TCT), must be passed before mass production. However, performing these reliability tests takes a lot of time and money, many researchers have introduced simulation techniques to reduce the number of experiments and significantly reduce the development time to save costs. We will fix the size of the critical mesh at a specific location on the solder ball and use this fixed mesh size in each finite element model. In this study, simulation results will be used in conjunction with modified energy based model and strain-based model to predict solder joint reliability. The results show that the difference between the experimental data and the simulation is within 10% or 100 cycles. Therefore, the simulation method proposed in this study is reliable and can successfully predict the reliability of electronic packaging.