Reliability-Based Design Guidance of 3D ICs Packaging with Wafer Level Underfill and Dummy Cu/Ni/SnAg Microbumps

Conference paper

C. C. Lee, P. T. Lin, K. S. Kao, R. C. Cheng, C. J. Zhan, J. L. Lau and T. C. Chang

Materials for Advanced Metallization Conference (MAM 2013) Materials for Advanced Metallization Conference (MAM 2013)

2013

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Title: Reliability-Based Design Guidance of 3D ICs Packaging with Wafer Level Underfill and Dummy Cu/Ni/SnAg Microbumps
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
P. T. Lin
K. S. Kao
R. C. Cheng
C. J. Zhan
J. L. Lau
T. C. Chang
Identifiers: 9957775945906774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Materials for Advanced Metallization Conference (MAM 2013) Materials for Advanced Metallization Conference (MAM 2013)